CFD Usage in Thermal Design
ASME Section Meeting

Date: May 20, 2003

Place: Higgins House at WPI, off Salisbury St., Worcester, MA

Schedule: 6:30 PM Social Hour, 7:00 PM Dinner, 8:00 PM Presentation

Subject: CFD Usage in Thermal Design

Program: Heat affects the reliability and lifetime of electronic equipment. As processing speeds rise, functional density increases, and equipment becomes smaller causing thermal problems to intensify.

Through techniques of computational fluid dynamics (CFD) the temperatures throughout the equipment can be predicted. This enables the engineer to identify the source of any over-heating, and to devise and test appropriate design modifications.

Typical applications range from computers and telecommunications equipment to less obvious examples such as the control electronics for lifts and domestic hi-fi equipment. FLOTHERM software from Flomerics enables an engineer to model multiple variations of a design quickly and efficiently, thereby producing an optimum solution. Brandon Goodwin of Flomerics, Inc. will give a talk about the use of numerical techniques in thermal design of electronic packages, presenting case studies and trends in high thermal density electronic packaging.

IEEE also welcome.

Dinner choices: Chicken Cordon Bleu and Baked Scrod - $15 ASME member & guest (half price for ASME student members)

RSVP by May 13: Janice 508-831-5425